VINIF.2019.DA12 – Controllable silicon-photonic network-on-chip via AI

Principle Investigator
Dr. Truong Cao Dung
Host Organization
Posts and Telecommunications Institute of Technology

– The project proposes breakthrough contributions in the design of modern integrated photonic circuits and devices based on silicon photonic technology – SiP with high optical performance and building information networks Integrated on an ultra-high-speed chip to control operational configuration and expand the topology space of the network.

– The project proposes to research and apply AI techniques to control fast reconfiguration, high-speed switching capabilities, and optimal and flexible path selection.

– Research contributions have great application potential in inter-chip optical communication systems, optical connection devices, fiber optic communication systems, high-speed computing and signal processing systems. In addition, the project’s contributions have great potential in the application of replacing elements and processing layers with optical microchips instead of electronic microchips in the nodes of artificial neural networks (ANN) and from there build high-speed photonic neural networks (PNN) for big data processing applications.

– The project aims to publish high-quality, prestigious international scientific articles in the SCI-Q1 category: 04 SCI-Q1 articles or 03 SCI-Q1 articles + 01 leading conference.

– The project will successfully manufacture 01 active SiP chip (complete prototype) for the first time in Vietnam using modern electronic circuit production technology.

– The project aims to successfully register 01 international patent in one of the four markets: US, Japan, UK, EU.

Principle Investigator
Dr. Truong Cao Dung
Host Organization
Posts and Telecommunications Institute of Technology

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Expect Progress
01/09/2019
01/05/2020
Phase 1

01 SCI-Q1 article.

01/12/2020
Phase 2

02 SCI-Q1 articles.

01/09/2021
Phase 3

(1) 01 Q1 article or 01 top international conference report;
(2) 01 complete silicon photonic chip sample product and 10 physical samples of the basic components that make up the chip;
(3) 01 acceptance of international patent applications in one of 04 locations: UK, US, Europe, Japan.

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