Research and develop technology for manufacturing uncooled thermal infrared image sensors, and demonstrate feasibility for investing in an industrial-scale production plant of these thermal infrared image sensors for domestic and regional needs.
The project has been accepted for completion in 2021. Currently, the project has moved into the Spinoff phase based on process innovation to manufacture new generation thermal imaging sensors, capable of minimizing dependence on microchip. Although not yet implemented during the project duration, the team was able to come up with an improved manufacturing process that minimized reliance on CMOS chips. This process has great potential to reduce manufacturing costs, enhance integration with neuroimaging computing components for image processing, and can be applied to the terahertz wavelength range. The research team agreed to further develop this process with a spinoff, and participated and became the Top 10 of Qualcomm Vietnam’s Innovation Challenge 2022 (QVIC2022). With this competition, the team was equipped with more knowledge, especially integrating with Qualcomm’s mobile platform. Currently, the project’s Spinoff has received its first round of investment, and in the near future there will be several more rounds of capital calls to bring the product to market.
Spinoff website: https://infrasen.vn/
